| 摘要 |
PURPOSE:To reduce the dust adhering to the surface of a wafer, to keep products clean, and to prevent the deterioration in quality of products by a method wherein the air stream in the form of air curtain is formed on the surface of a wafer. CONSTITUTION:Dustproof covers 28 and 30 are installed in upright position along the conveying direction on both sides of a wafer conveying surface, and a chamber 32 is provided in parallel with the wafer conveying surface at the upper part of the dustproof covers 28 and 30. The wafer conveying surface is enclosed by said dustproof covers 28 and 30 and the chamber 32. A slitlike air inlet 34 is formed on the lower surface of the chamber 32 facing the wafer conveying surface, and the clean air supplied to the chamber 32 from a flower (not shown in the diagram) through the intermediary of the air intake duct located at the upper part of the chamber 32, is blown directing to the surface of the wafer 26 from the air inlet 34. Besides, slitlike air outlets 38 and 40 are formed on the bustproof covers 28 and 30, the clean air flown directing to the surface of the wafer is flown out from the air outlet 38, and it is exhausted to outside passing through the exhaust duct 42 provided at the circumferential part of the dustproof covers 28 and 30 and the chamber 32. |
