| 摘要 |
PURPOSE:To etch an interlayer circuit substrate having signal lines at a high density into a fine pattern with high accuracy in the stage of performing said etching by moving back and forth the upper and lower ejection nozzle groups for an etching soln. to a substrate to be etched so as to cross the same alternately with each other at a specific angle. CONSTITUTION:Groups of upper spray nozzle pipes 7 and lower spray nozzle pipes 8 for an etching soln. are provided at the top and bottom of a route where a substrate 6 to be etched moves and many spray nozzles 9, 10 are installed to the respective pipes as an etching device for an interlayer circuit substrate having signal lines at a high density. The nozzle openings of the upper spray nozzle group are linearly moved back and forth in a specified direction and the nozzle openings of the lower spray nozzle group are linearly moved back and forth in the direction of + or -15 deg. to the direction intersection orthogonally with the linear forward and backward movement of the upper spray nozzle group when the substrate 6 passes the space between the upper and lower spray nozzle groups, whereby the top and bottom surfaces of the substrate 6 are etched simultaneously with high accuracy. |
