发明名称 |
Automatic liquid dispensing apparatus for spinning surface of uniform thickness |
摘要 |
An automatic fluid dispensing apparatus for coating to a substantially uniform thickness a rotating surface, such as the surface of a semiconductor wafer, with a viscous liquid, such as a slurry of passivating glass. The wafer rotation rate is related to the radial movement of a dispensing arm to maintain a constant tangential velocity of the wafer at the radial location of the dispensing arm while a bead of the slurry is dispensed at a constant rate proportional to the tangential velocity to provide a spiral beaded coating of constant volume per square. By allowing the bead to heal during or following the dispense cycle, the viscous liquid spreads to a uniform thickness.
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申请公布号 |
US4451507(A) |
申请公布日期 |
1984.05.29 |
申请号 |
US19820437835 |
申请日期 |
1982.10.29 |
申请人 |
RCA CORPORATION |
发明人 |
BELTZ, JOHN P.;HANG, KENNETH W. |
分类号 |
B01J19/18;B05C11/08;(IPC1-7):B05D3/12 |
主分类号 |
B01J19/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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