| 摘要 |
PURPOSE:To perform quickly and surely soldering to a printed circuit board by pressing the soldering positions of the lead terminals imposed on the prescribed position of flat package patterns by means of a press plate and scanning continuously the same back and forth by a laser beam. CONSTITUTION:A laser soldering device is constituted of an optical system 10 consisting of a laser device, a mirror and lens which change the direction of a laser beam and condense the same, a holding mechanism 12 which holds and positions a printed circuit board 11, and a press mechanism 16 which presses the plural lead terminals 15 arranged in parallel with each other on both sides of an electronic part 14 imposed on flat package patterns which are printed conductors deposited on the board 11 to fix the terminals in prescribed positions. The soldering positions of the terminals 15 are pressed with the mechanism 16 and the continuous region 27 including the soldering position of the terminals 15 is soldered by scanning continuously the laser beam back and forth. |
