| 摘要 |
PURPOSE:To reduce the size of device and improve reliability thereof by bending terminals at the area near the integrated circuit body and reinforcing the terminal by bonding it to the surface of integrated circuit device body with a bonding agent. CONSTITUTION:The connecting area of external circuit is reduced as much as the length of the terminal by bending almost at a right angle the terminals 5, 6 extended from the side surface of an integrated circuit body 4 of which surface is sealed by resin. Simultaneously the pasted bonding agent which is capable of bonding both terminal and resin part of body 1, for example, the pasted epoxy resin or fluorine resin are applied to said terminal which is bent in order to prevent the bending of terminals 5, 6 and the resin part of body 1. Then it is heated or hardened with mixture of hardening agent. Thereby, the terminal is fixed and reinforced. The terminals 5, 6 are fixed at the fulcrum by using the bonding agent 7 and crack and bending of terminal can be prevented. Moreover, it can also be prevented that a fine crack or missing is generated by a stress applied on the resin due to the bending of terminals 5, 6. |
