| 摘要 |
PURPOSE:To eliminate the generation of articles having unsatisfactory appearance and non-acceptable measurements as well as to cut down the cost of production by a method wherein, after a thin plate having the area larger than a device hole is provided at the lower part of the device hole, liquid resin is dripped from above a semiconductor chip. CONSTITUTION:A device hole 3 is provided on a circuit board 2. A semiconductor chip 1 is hung in midair in the hole 3 by wire bonding using a metal fine wire 4. A thin plate 8 has an area larger than the hole 3 and placed on the lower stand at the part directly below the hole 3. Liquid resin 6 is dripped from above the chip 1.The resin 6 covers the chip 1, the thin wire 4 and a part of the upper surface of the substrate 2, and also it is infiltrated into the gap formed by the lower surface of the board 2 and the upper surface of the thin plate 8 and adsorbed there. The resin 6 is hardened by heating. |
