| 发明名称 |
Electroless copper plating. |
| 摘要 |
<p>A non-fuming copper plating solution where formaldehyde fuming is eliminated by adjustment of the copper and formaldehyde to hydroxide. The preferred ratio of each to hydroxide is preferably at least 1 to 10.</p> |
| 申请公布号 |
EP0109015(A1) |
申请公布日期 |
1984.05.23 |
| 申请号 |
EP19830111030 |
申请日期 |
1983.11.04 |
| 申请人 |
SHIPLEY COMPANY INC. |
发明人 |
ABU-MOUSTAFA, MAGDA;VALAYIL, SILVESTER PAUL |
| 分类号 |
C23C18/31;C23C18/40;(IPC1-7):23C3/02 |
主分类号 |
C23C18/31 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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