发明名称 RESIN MOLDED ELECTRONIC COMPONENT PARTS
摘要 PURPOSE:To prevent the generation of bubbles in the molding section of a molded product, to which extremely thin molding is executed, by thinly forming sections in the vicinity of both end sections of the principal section of a material to be molded viewing from a resin injection port. CONSTITUTION:The sections in the vicinity of both end sections of the principal section of the material to be molded such as the molding section 12 of the upper surface of a pair of both-side leads 11 of a pellet 10 are formed thinly. That is, the cavity section of the lead upper surface section of the cavity 14 of a molding top force 13 is thinned, the inner surface of the corresponding molding top force 13 is projected and projecting sections 15 are formed, a flow path for the resin is narrowed and the pipe resistance of the flow path is increased, thus reducing the velocity ratio of the flow of the resin flowing on the pellet 10 to the flow of the resin flowing on the circumferential fringe of the pellet 10. Ac- cordingly, the flow on the pellet is slower than the flow of the resin flowing on the upper and lower surfaces of a lead, but a closed space to be generated as the result of the resin going around onto the pellet from both sides is prevented from occurring.
申请公布号 JPS5980951(A) 申请公布日期 1984.05.10
申请号 JP19830153324 申请日期 1983.08.24
申请人 HITACHI SEISAKUSHO KK 发明人 SHIMIZU TAKESHI;OOTSUKI KEIZOU;MOCHIZUKI HIDETOSHI;YOSHIDA HISASHI
分类号 H01L23/50;H01L21/56;H01L23/28;H01L23/31 主分类号 H01L23/50
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