| 摘要 |
PURPOSE:To improve the accuracy of sealing of a sealing section, and to realize the continuous operation of a continuous frame by bending a lead section before sealing treatment. CONSTITUTION:A semiconductor element 5 is welded to the adequate position of a lead frame 4 under a flat state, and the electrode pads of the element 5 and leads made correspond to the pads are connected electrically by wires 6. A spacer is arranged along where corresponding to the side surface of a base 2, rods for bending the lead are dropped from the upper section of the frame 4 and lead sections 4a are pushed and bend downward, and a cap 3 and the base 2 are made corresponde to the principal section of the frame 4, pushed against it and welded and sealed from the upper and lower sections of the frame 4. In this case, the frame is held by the cap 3 and a base 2 member from upper and lower sections through a substance such as glass for welding, and a heat block heated at approximately 500 deg.C is pushed against it from the upper and lower sections of a sealing member. |
