| 摘要 |
PURPOSE:To eliminate the need for the use of Au, and to reduce cost by bonding one tip of an Al or Al alloy wire with the pad of a pellet and bonding the other tip on an Ni or Ni group metal plated film formed on a mounting substrate. CONSTITUTION:The upper section of a Cu wiring 2 on the glass epoxy substrate 1 is plated with Ni or plated 9 with Ni containing not less than 0.1% P. One of the tips of the Al or Al alloy wires 10 containing 1% Si is connected to the Al pad of the pellet 5, and the other tip is bonded to the plated film 9 of the substrate 1. The wires and the pellet are sealed with an epoxy resin. The cost of the device is reduced largely because no Au material is used. |
