发明名称 FORMATION OF WIRING STRUCTURE
摘要 PURPOSE:To obtain a flat insulation layer by a method wherein a conductor layer of a prescribed pattern is formed on a substrate and the 1st insulation layer of approximately the same thickness as the conductor layer is formed on the part of the substrate other than the pattern of the conductor layer and then an insulation layer for the prescribed pattern is formed. CONSTITUTION:The conductor layer 5 of a prescribed pattern is formed on a substrate 4 and an insulation layer 6 of approximately the same thickness as the conductor layer 5 is formed between the conductor pattern 5 and 5. After the difference in level between the conductor pattern 5 and 5 is thus filled, an insulation layer 7 is formed and a flat insulation layer is obtained. Moreover, a conductor layer 5 and an insulation layer 6 can be formed on the insulation layer 7 and an insulation layer can be formed on them. By laminating successively like this, multi-layer conductor can be formed. By the precision leveling like this, photo-lithography technology can be used and a magnetic circuit which is especially useful in case of composing a thin film magnetic head.
申请公布号 JPS5974608(A) 申请公布日期 1984.04.27
申请号 JP19820183672 申请日期 1982.10.21
申请人 HITACHI SEISAKUSHO KK 发明人 TAKEMOTO KAZUNARI;KATAOKA FUMIO;SHIYOUJI FUSAJI;YOKONO ATARU;KUWAZUKA SHIYUNICHIROU
分类号 H05K3/46;G11B5/17;G11B5/31;H01F17/00;H01F27/00;H01F41/04 主分类号 H05K3/46
代理机构 代理人
主权项
地址