| 摘要 |
PURPOSE:To make the inductance at the connecting part of a chip capacitor small, by attaching the chip capacitor between the power source and the grounding of a semiconductor lead frame, thereby making a mounting density large. CONSTITUTION:A specified patterning of a metal such as Kovar is performed, and a lead frame is formed by performing etching or blanking by a press form. A plurality of leg shaped outer lead parts 5 of the lead frame and an IC chip 7 mounted on a rectangular stage 6, which is provided at the central part, are bonded and electrically connected by wires 8. In the case of, e.g., 16 pin semiconductor, 16 legs from No.1 to No.16 are provided except tie bars 10a and 10b, which support the stage part, with groups of 8 pieces being arranged on the right and left sides. A land part 11 for mounting a chip capacitor is provided at a part of the lead part of the No.8 pin 5a, which is the power source pin. The IC chip 7 is attached to the stage 6 by resin, metal, or the like. |
