| 摘要 |
PURPOSE:To reduce generation of void and obtain better junction by previously setting the area of principal surface of the solder foil to 25% or less of the area of principal surface of element on the occasion of junctioning element to the semiconductor element disposing surface by soldering. CONSTITUTION:A ring-shaped groove 8 is formed on the surface of element disposing surface 2', the nickel plated layer 1 is formed at the entire part including such surface, and a semiconductor element 3 having the nickel plated layer 1 at the lower part is settled by solder 5''. At this time, the area of solder 5'' to be placed in the groove 8 is set to 25% or less of the area of element 3. Thereby, the void is not generated in the solder 5'' and heat radiating characteristic is not lowered and excellent junction can be obtained. |
