| 摘要 |
Acid copper electroplating solutions containing the reaction product of (1) a compound of formula (I), where R1 and R2 are lower alkyl radicals of 1 to 6 carbon atoms, a hydrogen atom or mixtures thereof and R4 an alkali metal, hydrogen, magnesium, or the groups SX or SSX where X is an alkali metal, hydrogen or magnesium, or (II), where R3 is an aromatic, heterocyclic or alicyclic radical containing 3 to 12 carbon atoms and R4 an alkali metal, hydrogen, manganese, or the groups SX or SSX where X is an alkali metal, hydrogen or manganese, (2) a compound of the formula XR1 - (S)n - R2 - SO3H where R1 and R2 are the same or different and are alkylene radicals containing 1 to 6 carbon atoms, X is hydrogen or -SO3H and n equals 2 to 5, and (3) acrylamide in a sufficient amount to increase the brightness of the deposit and/or to prevent the formation of cracks during thermal shock. |
