| 摘要 |
PURPOSE:To save connection space and man-hours by bending the end point of external lead mounting a semiconductor chip among the external leads for an angle more than the specified angle and by connecting it to one of the external lead electrode at the surface of semiconductor chip. CONSTITUTION:The end point of external lead 12 mounting a semiconductor chip 1 is bent for 90 degrees of more, and it is directly soldered to an external lead electrode 5 at the area near the end point of the bending portion 12a. According to such method, the lead wire for wire bonding is no longer required and thereby the space within the sealed resin mold can be saved and accuracy of positioning for mounting semiconductor chip to the lead can also be improved. |
