发明名称 HOT PLATE TYPE WAFER HEATER
摘要 PURPOSE:To quicken a rise in temperature, to shorten a hot plate part to form the titled device in a small type, and to facilitate the control of heating by a method wherein conveying rails are made to perform square motion completely to heat a wafer directly. CONSTITUTION:When an air cylinder 19 is operated in the advancing direction, and sliders 15 are slidden on rollers 17, the rails 2 ascend to hold up the wafer 11 on a table. Then a pulse motor 24 is operated to rotate a driving shaft 23, the rails 2 are transferred ahead together with a bearing frame 18, and the wafer 11 is transferred on a hot plate 1. When the air cylinder 19 is operated in the reverse direction at the prescribed position, the sliders 15 descend on the rollers 17, and the wafer 11 is put on the hot plate 1. When the rails 2 sank in the hot plate 1, by reversing the pulse motor 24, the rails 2 are returned to the original position. After the wafer 11 is heated directly by the hot plate 1, and the processes of drying and so forth are finished, the wafer 11 is transferred to the next process by making the rails 2 perform motion mentioned above.
申请公布号 JPS5955021(A) 申请公布日期 1984.03.29
申请号 JP19820165758 申请日期 1982.09.22
申请人 TERUMETSUKU:KK 发明人 SEKI JIYUNICHI;TSUJI MASAO
分类号 G03F7/26;G03F7/40;H01L21/027;(IPC1-7):01L21/30 主分类号 G03F7/26
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