发明名称 |
GOLD OR GOLD ALLOY WIRE FOR BONDING SEMICONDUCTOR CRYSTAL INSEMICONDUCTOR STRUCTURE ELEMENT TO CONNECTING POSITION |
摘要 |
Known gold and gold-alloy wires for connecting semiconductor chips to terminals on the lead frame often exhibit loop formations, drifts and excess lengths when automatically bonded. This is avoided if at least 50% of the crystallites in the wire have a preferred orientation in the axial direction corresponding to a &Lang&100&Rang& fibre structure. |
申请公布号 |
JPS5948948(A) |
申请公布日期 |
1984.03.21 |
申请号 |
JP19830146781 |
申请日期 |
1983.08.12 |
申请人 |
DEMETORON G FUYUURU EREKUTORONIIKU BUERUKUSHIYUTOTSUFUE MBH |
发明人 |
FUORUKAA RUSUBIYURUTO;GIYUNTAA SHIYURANPU;BUORUFURAMU MARUCHIN |
分类号 |
C22C5/02;B23K1/00;H01L21/60;H01L23/49 |
主分类号 |
C22C5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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