发明名称 GOLD OR GOLD ALLOY WIRE FOR BONDING SEMICONDUCTOR CRYSTAL INSEMICONDUCTOR STRUCTURE ELEMENT TO CONNECTING POSITION
摘要 Known gold and gold-alloy wires for connecting semiconductor chips to terminals on the lead frame often exhibit loop formations, drifts and excess lengths when automatically bonded. This is avoided if at least 50% of the crystallites in the wire have a preferred orientation in the axial direction corresponding to a &Lang&100&Rang& fibre structure.
申请公布号 JPS5948948(A) 申请公布日期 1984.03.21
申请号 JP19830146781 申请日期 1983.08.12
申请人 DEMETORON G FUYUURU EREKUTORONIIKU BUERUKUSHIYUTOTSUFUE MBH 发明人 FUORUKAA RUSUBIYURUTO;GIYUNTAA SHIYURANPU;BUORUFURAMU MARUCHIN
分类号 C22C5/02;B23K1/00;H01L21/60;H01L23/49 主分类号 C22C5/02
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