发明名称 COPPER ELECTROPLATING BATH INCLUDING COMPOUND WITH SUBSTITUTED PHTHALOCYANINE RADICAL
摘要 <p>A composition and method for electrodepositing ductile, bright, level copper deposits from an aqueous acidic copper plating bath having dissolved therein a brightening amount of a compound comprising a substituted phthalocyanine radical. In accordance with a preferred embodiment, the composition and method further includes in the copper plating bath secondary brightening agents including aliphatic polysulfides and/or organic sulfides and/or polyethers, as well as other known additives for acid copper plating baths.</p>
申请公布号 CA1163953(A) 申请公布日期 1984.03.20
申请号 CA19810368435 申请日期 1981.01.13
申请人 OXY METAL INDUSTRIES CORPORATION 发明人 COMBS, DANIEL J.
分类号 C25D3/38;(IPC1-7):C25D3/38 主分类号 C25D3/38
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