发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 PURPOSE:To make multiple terminal wiring easy by a method wherein an Al wire not coated with an insulating material is coated with an insulating film by means of an anode oxidation after wiring operation. CONSTITUTION:A pad 4 of IC chip 1 and a lead frame 6 are connected to each other using a bare Al wire 5 and the surface is immersed in oxalic acid solution 7 while an anode of power supply 8 and the other electrode are respectively connected to the lead frame 6 and the electrode of the solution 7 forming an Al2O3 film 10 on the surface of the Al wire 5. In such a constitution, the Al2O3 film may prevent a shortcircuit from generating making multiple terminal wiring easy.
申请公布号 JPS5946054(A) 申请公布日期 1984.03.15
申请号 JP19820156416 申请日期 1982.09.08
申请人 NIPPON DENKI KK 发明人 MARUI YOSHIMI
分类号 H01L21/60;H01L21/48;H01L23/49;H01L23/495 主分类号 H01L21/60
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