| 摘要 |
PURPOSE:To measure the purity of a sealing resin by irradiating X-rays, electron rays or gamma-rays to a semiconductor sealing resin material and detecting the intrinsic X-ray intensity generated by the chlorine atom in the material. CONSTITUTION:An element sealed with an epoxy resin for semiconductor sealing as a sample is polished of its surface with sand paper, whereafter the element is cleaned with ethyl alcohol. X-rays are irradiated to the surface thereof, and the intrinsic X-ray (ClKalpha ray) of chlorine of 4.73Angstrom wavelength in the generated X-rays is separated by a germanium single crystal. The intensity thereof is detected with a proportional counter and the content of chlorine is detected. The sample may be powder which is a raw material for molding or may be the material after formed into the element. The detection of the chlorine content up to 10ppm with the sample of about 30mm. diameter produced by pressure molding of resin powder and up to 50ppm with the same of about 5mm. width sealed therein with a semiconductor is possible. |
