| 摘要 |
PURPOSE:To enable to mount a plurality of pellets at higher density by a method wherein a plurality of pellets are directly adhered to each other, and each pellet is electrically connected. CONSTITUTION:The pellets 10-13 are bonded on a ceramic substrate 5, and each pellet is directly adhered on side surfaces by means of adhesive 14. This adhesion part has the formation of a metal 17 for pellet connection purpose which electrically connects each pellet. This metal 17 is formed by photolithography technique. The electrode pad of each pellet is connected to metallic wiring patterns 7 on the substrate 5 by means of wires 18 and so formed as to conduct to external leads 9. This method enables to mount a plurality of pellets at higher density and then contrive further to form them into multi-terminal ones with the same pellet size. |
