| 摘要 |
PURPOSE:To make it possible to machine a miniature size electronic part or the like with a high degree of accuracy, by allowing a tool to approach the outer surface of a workpiece without making into direct contact therewith, and by generating cavitation with the use of ultrasonic waves. CONSTITUTION:A tool 12 is attached to an ultrasonic vibrator 10 through the intermediary of a support member 13. Meanwhile, a workpiece 15 which is a miniature size electronic part such as an integrated circuit or the like, is disposed in machining liquid 17 filled in a container 16. At this stage, the tool 12 is made to approach the outer surface of the workpiece 15 without making into direct contact with the latter, and cavitation is effected by ultrasonic vibration. During breakage of the cavitation, dynamic actions such as negative pressure, shock waves or the like, and a temperature rise are effected, resulting in micro-cut-off, in a contactless condition with a high degree of accuracy. Further, it is possible to enhance the efficiency of machining. |
