发明名称 Electroplating arrangements
摘要 An electroplating arrangement having particular use in the manufacture of stamper plates for disc record production comprises a rectangular plating bath, one side being non-vertical with respect to the bath base. A filter screen divides the bath into an anode region and a cathode region, the region including anode and cathode electrode arrangements respectively. A stamper plate to be plated is mounted on the cathode electrode arrangement which is connected to a motor capable of rotating the arrangement about an axis perpendicular to the plate. The anode arrangement comprises an elongate porous bag containing anode material and is disposed parallel to the cathode arrangement and non-vertical wall. An electrolyte input pipe extends through the bag and screen to lie opposite the mounted stamper plate directing inflowing electrolyte thereat. An output exit is disposed within the anode region on the bath base such that the anode arrangement lies within the flowpath from said entrance to said exit.
申请公布号 US4435266(A) 申请公布日期 1984.03.06
申请号 US19820428525 申请日期 1982.09.30
申请人 EMI LIMITED 发明人 JOHNSTON, SAMUEL J. B.
分类号 B29C33/00;B29C43/32;B29C61/00;B29D17/00;C25D1/10;C25D5/08;(IPC1-7):C25D21/12 主分类号 B29C33/00
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