发明名称 |
Dew-point thimble |
摘要 |
The dew-point thimble (Fig. 2) carries on a substrate (1) a pair of tapping electrodes (2, 3) and a number of humidity-sensitive elements (4) connecting the tapping electrodes, which are located opposite one another at a distance. Parts of the tapping electrodes are situated free or uncovered in the region of interspaces present between the humidity-sensitive elements (4). <IMAGE>
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申请公布号 |
DE3231422(A1) |
申请公布日期 |
1984.03.01 |
申请号 |
DE19823231422 |
申请日期 |
1982.08.24 |
申请人 |
MURATA MANUFACTURING CO.,LTD. |
发明人 |
MURATA,MICHIHIRO;KUMADA,AKIRA |
分类号 |
G01N27/04;(IPC1-7):G01W1/14;G01N27/02 |
主分类号 |
G01N27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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