发明名称 |
Method and system for encapsulating electronic components into plastic material. |
摘要 |
<p>Method for encapsulating parts of elements (11) into a plastic material to manufacture electronic components. The mould has one or more parallel rows of mould cavities (6), into which a plastic material is injected through one or more sprues (4). The elements are part of a strip (1) of which the length is a multiplicity of the length of a row of cavities, which strip is step by step treated in said mould such that an uninterrupted strip of components is obtained.</p> |
申请公布号 |
EP0101630(A1) |
申请公布日期 |
1984.02.29 |
申请号 |
EP19830201115 |
申请日期 |
1983.07.27 |
申请人 |
ARBO HANDELS- EN ONTWIKKELINGSMIJ B.V. |
发明人 |
BOSCHMAN, EVERARDUS HENDRIKUS |
分类号 |
B29C45/00;B29C45/14;B29C45/46;B29C61/00;H01L21/56;(IPC1-7):01L21/56 |
主分类号 |
B29C45/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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