| 摘要 |
<p>PURPOSE:To make the connection of W conductors highly reliably by a method wherein diffusion is made to generate between W and N, Ni and Au after applying non-electrolytic Ni plating and non-electrolytic Au plating at connection parts, which are printed with metallic paste containing glass, and calcination is performed. CONSTITUTION:Non-electrolytic Ni plating 5, non-electrolytic Au plating 6, and sintering 7 are performed to the W wiring conductors firmly bonded to a ceramic substrate. Thereby, mutual diffusion is performed between the W conductor and the Ni plated layer, and between the Ni and Au plated layers. Further, the plated layers are printed with the Ag-Pd paste containing glass which has been finished in paste adjustment 12, and the calcination is performed after drying it.</p> |
