| 摘要 |
Methods for forming high density conductive circuit patterns and electrical interconnections thereto. A pattern of conductors 18a, 18b, or bus-bars, is initially fabricated by electroplating or electroforming utilizing photoresist pattern delineation. Next, the conductors are overcoated with a thin insulating photosensitive film (11). Thereafter, a two-dimensional array of lead-width vias (12) are formed in the photosensitive film to expose the underlying conductors. The vias are spaced one from another in a predetermined matrix array so that the spacing between adjacent vias is greater than the spacing between adjacent conductors in the underlying circuit. Next, a conductive material (15) is electroplated through the vias and over the photosensitive layer to form comparatively large mushroom-shaped interconnect bumps. For added strength, the bumps and associated structure may be coated with a layer (17) of epoxy which, after curing, is abraded to expose a two-dimensional array of flat bonding pads (19). <IMAGE> |
