发明名称 METAL MOLD FOR RESIN SEALING OF SEMICONDUCTOR
摘要 PURPOSE:To enable to form easily the radiation fin buried type resin sealed product, etc., by a method wherein an ejector pin is so provided in the metal mold main body as to enable one edge part thereof to go and out by the prescribed quantity in a cavity. CONSTITUTION:The hollow part 21 to form the external shape of the resin sealed product is formed on the upper part of a bottom force 20, and a pin inserting hole 22 to communicate with the bottom of the cavity 21 is penetrated. The ejector pin 23 is inserted sliding freely in the inserting hole 22 thereof by introducing the edge part from the bottom force 20. Another edge part drawn out from the hole is fixed to an elevating base 24 provided facing to the lower face of the bottom force 20, and the elevating base 24 is separated by the prescribed interval from the bottom force being interposed with a spring 25 between the bottom force 20. The elevating mechanism is constructed of a cam 27 fixed rotation freely to the side of the elevating base 24 and a rotary lever 28. By a simple operation only to operate the rotary lever 28, the quantity of projection of the ejector pin 23 in the cavity 21, or the quantity of drawing out from the cavity 21 can be set up to the prescribed value.
申请公布号 JPS5933839(A) 申请公布日期 1984.02.23
申请号 JP19820143712 申请日期 1982.08.19
申请人 TOKYO SHIBAURA DENKI KK 发明人 TOGASHI MINORU;NOMURA TOORU
分类号 H01L21/56;B29C43/00;B29C45/00;B29C45/02;B29C45/14;B29C45/26;B29C45/40 主分类号 H01L21/56
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