| 摘要 |
For hybrid circuits, in particular in power electronics, metal layers which adhere particularly well to the substrate surface are required. The process according to the invention enables the preparation of metallised surfaces of this type on glass, enamel or glass-like substrate surfaces. To this end, a coating of metal powder or metal oxide powder (3) is applied to the substrate surface (2) and covered by a ceramic plate (4), this arrangement is warmed to above the softening point of the surface material (2), and the powder (3) is simultaneously pressed into the substrate surface (2) by means of a force (F) on the ceramic plate (4). A positive and chemical bond of the metal powder (3) with the glass or the glass-like substrate surface (2) is formed. <IMAGE>
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