| 摘要 |
PURPOSE:To enable to plate a sheath having excellent corrosion resistance in less number of steps by leading out a metal layer for placing a semiconductor element, a metal frame for sealing and leads via conductors to the short side of a package substrate, shortcircuiting them via shortcircuiting conductors, thereby eliminating the inconvenience in case of plating the sheath. CONSTITUTION:A conductive film 6a connected to a metal layer 6 for placing an element provided on the bottom of an inner cavity of a package substrate 10, a conductive film 4a connected to leads 4 and a conductive film 3a connected to a sealing ring 3 are led out to the position in the vicinity of the short side surfaces of the substrate, and shortcircuited via shortcircuiting conductors 12 such as Ag paste for conduction. A semiconductor element 7 is containd in this package, connecting fine wirings 8 are connected between the electrodes of the element and the bonding pad of the package, a metal cap 1 is hermetically sealed, and a sheath is the plated. |
