Use of a palladium alloy in dental technology

摘要

A silver-free palladium alloy of 75 to 85 % of palladium, 3 to 17 % each of indium, tin and/or gallium and 8 to 12 % of copper is used for bonding ceramic materials in dental technology. The copper content ensures that, shortly after reaching the melting point, the melt of the alloy has such a low viscosity that harmful overheating of the melt to reach the necessary cavity filling power is avoided. In spite of the formation of copper oxides, there is no discolouration of the ceramic facing on the alloys.