| 摘要 |
PURPOSE:To prevent the contact of a conductor pattern with the back surface of an IC chip and the occurrence of the erroneous operation of an IC chip by positioning the chip so that the chip may not be disposed on the pattern. CONSTITUTION:A ceramic substrate 6 and a printed circuit board 5 are secured on a supporting plate 7 so that the interval between the substrate 6 and the board 5 becomes slightly wide, and when a tape carrier 9 is mounted by outer lead bonding over the substrate 6 and the board 5, an IC chip 8 is positioned so that the chip 8 is disposed at the interval between the substrate 6 and the board 5. Even if force is applied to the carrier 9 from above so that the chip 8 moves downwardly, the chip 8 may not contact with the common electrode or other electrode pattern on the substrate 6 nor wiring pattern on the plate 7. |
