| 摘要 |
PURPOSE:To enable to mount in high density by fixing an Si substrate on a ceramic base when mounting flip-chip type semiconductor pellet elements in a package having the ceramic base, forming a circuit pattern by a photographic technique on the surface, and face-down bonding the pellet. CONSTITUTION:A plurality of external pins 11 are projected on the periphery of the lower surface of a package base 10 made of a ceramic material, and conductor 11a is arranged on the periphery of the upper surface of the base 10 via through holes, not shown. Then, an Si substrate 12 is secured to the center on the upper surface of the base 10, a thin aluminum circuit pattern 13 is formed on the upper surface, pellet pads 13a is arranged in the vicinity of the center and wire pads 13b are arranged on the periphery by photographic technique. Subsequently, the pellet 14 is face-down bonded to the pad 13a, and wires 15 for connecting the pin 11 to the conductor 11a are connected to the pad 13b. Then, a cap 17 is mounted via resin 16 on the surface. |
