| 摘要 |
PURPOSE:To load and connect a plurality of pellets to a full automatic pellet loader loading and connecting one pellet and a full automatic bonding device by forming a section, on which a semiconductor chip is loaded, to a recessed shape and forming the side surface of the recessed section in bimetal structure by using a substrate metallic material and a metal of a thermal expansion coefficinet different from that of the material. CONSTITUTION:When the lead frame 11 is heated, the inclinations of the side surfaces 4a, 4b of the recessed section of the pellet loading section are made gentle by the bimetal structure of a substrate metal and Invar 5 of a small thermal expansion coefficient. When the temperature of the frame 11 is deopped, the inclinations of the side surfaces 4a, 4b of the concave section are brought close to verticality owing to the bimetal structure, a pellet 2 being loaded on an inclined plane is pushed in toward other two sides with no bimetal structure, and angular displacement and positional displacement on loading are compensated. |
