| 摘要 |
PURPOSE:To facilitate the observation on a CRT in non-contact testing and diagnosis on a semiconductor device, by regularly arranging a plurality of position-detecting marks on a chip. CONSTITUTION:An English character B is disposed at each lattice intersection position. Reference numerals 5 and 6 denote a semiconductor substrate and a bonding pad, respectively, while an oblique line part represented by a numeral 7 is an internal circuit part. A geometric mark 12 disposed on each lattice intersection should have a configuration which facilitates the position detection when testing or diagnosis is carried out in a non-contact manner. In the Figure, numerals 9 and 10 denote a semiconductor substrate and a bonding pad, respectively, while an oblique line part represented by a numeral 11 is an internal circuit part. |
