| 摘要 |
PURPOSE:To enable to obtain a plurality of detection elements in a highly efficient manner by a method wherein a number of semiconductor chips are adhered on the base stand which are divided by marking lines, thereby enabling to collectively form said detection elements under the above-mentioned condition. CONSTITUTION:A number of divided regions 3 are formed using marking lines 2 on the main surface of the supporting base stand 1 consisting of a silicon plate. Then, a recessed hole 4 is formed in the center of each divided region 3 and a supporting plate 5, consisting of sapphire, is attached to each divided region 3 using the adhesive agent dripped into said hole 4. Subsequently, multiple element semiconductor chips 6 are adhered to each supporting plate 5 and, at the same time, a grinding work is performed on these chips 6 to give them the prescribed thickness and, at the same time, the desired infrared ray detection element 7 is formed on each chip. Lastly, the supporting plate 5 is separated from the base stand 1, and an infrared ray detection element 8 can be obtained. |
