| 摘要 |
To apply an electronic component such as an active or passive element of essentially block form with end strips or caps of conductive material to a substrate such as a printed circuit (PC) board, for subsequent soldering of the conductive strips or caps to conductors on the PC board by immersion or wave-soldering of the component and PC board in a solder bath, a controlled amount of adhesive is applied on the surface of the component between the end strips, to leave clearance space between the adhesive material and the end strips, so that the amount of material being applied can be accurately controlled. The adhesive material, preferably, is applied in form of a double-faced, double-sided adhesive strip, possibly with an intermediate foam or similar core so it can compress; the thickness of the core can be matched to the thickness of the end strips or caps. The clearance space avoids interference between adhesive material and solder connections between the end strips or caps and the conductive strips on the PC board.
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