发明名称 |
The packaging of semiconductor chips. |
摘要 |
<p>In hermetically sealing a package for a semiconductor chip (50) a ceramic receptacle (41) having leads (42) and a metal frame (43) fixed to the ceramic receptacle has a metal lid (44) set inside the metal frame (43) and the metal lid and the metal frame joined by laser welding. By using such a laser welding technique, damage to the chip by overheating can be avoided, while still permitting desirably high productivity.</p> |
申请公布号 |
EP0098176(A2) |
申请公布日期 |
1984.01.11 |
申请号 |
EP19830303811 |
申请日期 |
1983.06.30 |
申请人 |
FUJITSU LIMITED |
发明人 |
WATANABE, HISASHI;SUGAHARA, TAKEHISA |
分类号 |
B23K26/00;B23K26/20;H01L21/50;H01L23/02;H01L23/057;(IPC1-7):01L23/04;01L21/50 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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