| 摘要 |
PURPOSE:To enable to prevent the generation of multiple reflection phenomenon of a high frequency input signal by a method wherein a by-pass earthed circuit is provided from the bonding pad to be connected to the semiconductor chip to be tested, and an impedance matching terminal resistor is connected to said earthed circuit. CONSTITUTION:A needle-like conductive substance 6 is contacted to the same bonding pad as a probe 2 at the approximate point to it. The other end of the needle-like conductive substance is connected to a terminal resistor 5, and the other end of the terminal resistor 5 is connected to a grounded surface 31 through the intermediary of a wire 7. As the terminal resistor 5 is inserted into the by-pass earthed circuit located between the bonding pad to be connected and an earth 31, a high-speed input signal is absorbed into the terminal resistor 4, and no multiple reflection phenomenon is generated. |
