摘要 |
The invention relates to a device for applying glue, in particular by means of an automatic gluing machine, as a preparatory step for gluing profiled parts, in particular frame profiles in the area of a mortice joint or the like. A more economical and versatile use of such a glue application device is ensured by a bundle of line-shaped glue application elements which are elongated under stress at a short distance from one another, preferably essentially in parallel, in a frame element and yield elastically in a lateral direction under the effect of the profiled part to be glued.
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