| 摘要 |
PURPOSE:To prevent the formation of films to two desired opposite surfaces by bringing the first surfaces of a plurality of chip-shaped or array-shaped semiconductor elements into contact with a predetermined base surface and arranging them, covering a plurality of the semiconductor elements in common while being brought into contact with second surfaces opposite to the first surfaces and forming desired films to the exposed surfaces of the semiconductor elements. CONSTITUTION:Laser chips 11 under the state of arrays are arranged onto the predetermined base 12 in a vapor growth chamber at proper intervals while first electrodes such as electrodes on the epitaxial growth layer sides are brought into contact with the upper surface of the base 12. Accordingly, second electrodes such as electrodes on the substrate side of the laser chips 11 under the state of arrays appear on the upper surfaces of the laser chips 11. A shielding plate 13 is disposed while being made common with a plurality of the laser chips 11 and being brought into contact with the upper surfaces of the chips. According to the arrangement, the main surfaces of the second electrodes of the laser chips 11 are covered with the shielding plate 13, and end surfaces A and B containing the optical resonator reflection planes of the laser chips 11 are brought to the states in which they are exposed to space held by the base 12 and the shielding plate 13. |
