| 摘要 |
<p>Alkali-soluble hot melt adhesive compositions are provided which contain (a) about 10 - 40 weight % of an alkenyl succinic anhydride, (b) about 30 - 50 weight % of a copolymer of ethylene and acrylic or methacrylic acid, and (c) about 10 - 50 weight % of rosin.</p> |
