| 摘要 |
PURPOSE:To elongate the life of the semiconductor laser by directly immersing a semiconductor laser chip or a package containing a chip in inactive, noncombustible or fire retardant cooling liquid, and cooling the chip highly efficiently. CONSTITUTION:A light transmitting glass wall 2 is provided on the open side of the package 4, the semiconductor laser chip 1 is fixed to the inside of the wall 2 by using a sealing material 6. An optical fiber 7 which monitors the back surface and controls the output of the chip 1, is attached to the back surface of the chip. Then the other end of the optical fiber 7 is protruded to the outside, and a heat radiating plate 5 is attached to the package 5. The cooling liquid 3 of a CNF2N+2(N=4-7) chain compound which is a fluorocarbon series compound that does not include a C-OH group, a C=O group, or a C=C group is enclosed in the package 4. At this time, the liquid 3 is not completely enclosed and a space is left in the upper part, so that the space is filled up with the vapor of said liquid. The condensating heat, which is generated when the vapor is condensed and returned to the liquid, is irradiated from the outer wall. |
