| 摘要 |
PURPOSE:To prevent the titled elements from being damaged due to stain and oxidation while making the manufacturing processes of the elements simple and easy by a method wherein the surface of the elements excluding weak bonded parts is covered with the oxide film of weak bonding material. CONSTITUTION:A super conductive material is evaporated on a substrate 1 through a resist mask to leave a super conductive thin film 2 removing the mask. The resist mask with a bandlike window partially facing to the super conductive film 2 is arranged to be evaporated with a semiconductor material such as SiO2 as well as a super conductive material leaving the super conductive thin film 2 after removing the mask. Next an oxide film is removed from the surface of the laminated thin film by means of sputter-cleaning the overall surface of said laminated thin film. Then the overall surface is evaporated with a weak bonding material to form a thin film 7. A resist mask 6 corresponding to a weak bonding part 5 is formed on the position intersecting the thickness side of an insulator layer 4 of said laminated thin film 7 to oxidize the thin film 7 made of weak bonding material. Through these procedures, the part of thin film covered with the resist mask 6 not to be oxidized may form the weak bonding part 5. |
