发明名称 WIRE BONDING APPARATUS
摘要 PURPOSE:To automatically execute wire bonding even if hybrid substrates having different pellet mounting numbers are conveyed by providing common wire bonding information to information forming means in response to the number of pellets to be mounted on a substrate, and wire bonding information to be increased or deleted. CONSTITUTION:An image signal output from an ITV camera 21 is A/D- converted, fed as image data to a recognition controller 22, and the positions of hybrid substrates 12a, 12b, 12c are recognized. Positions on the substrate of each pellet A or positions of pad electrode lead terminal at pellet A are stored as wire bonding information R1. Wire bonding information R2 of each pellet A of the center 12-2 and wire bonding information R3 of each pellet A of right side center 12-3 are stored as pellet wire bonding information. A central controller 25 form wire bonding information corresponding to hybrid substrates 12a-12c conveyed to a line from the information R1-R3 and executes the bonding according to the information.
申请公布号 JPS62190736(A) 申请公布日期 1987.08.20
申请号 JP19860033357 申请日期 1986.02.18
申请人 TOSHIBA CORP 发明人 YAMAGUCHI MASAYOSHI
分类号 H01L21/60 主分类号 H01L21/60
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