| 摘要 |
PURPOSE:To facilitate control of resin quantity by a method wherein solid type resin of largeness nearly the same with a semiconductor element is put on a lead frame, the semiconductor element is put thereon, and the element and the lead frame are fixed. CONSTITUTION:A foil piece 22 of non hardened conductive resin having the area nearly the same with a semiconductor element 23 is added on a lead frame 21. Then the element 23 is put on the added resin piece 22 using a jig 24, the resin piece 22 is molten by heating the lead frame 21, the element 23 is pressed thereafter, moreover the element 23 is scribed, and resin 22 is stretched out to fix the element 23 and the lead frame 21. According to this method, the resin quantity can do by a small quantity, and moreover control of the resin quantity is facilitated. Moreover even when the element 23 is caught by the jig 24 to be pressed and to be scribed, creeping up of resin 22 up to the side to contaminate the jig 24 is not generated. |
