发明名称 HEAT-SENSITIVE PAPER WIH IMPROVED SCUM ADHESION
摘要 PURPOSE:To obtain heat-sensitive paper with controlled scum adhesion to a thermal head wherein a specified amount of a water-insoluble urea/formalin resin in a powder state with a specified oil absorption is incorporated in a heat- sensitive layer, which basically includes a color forming lactone compound and a phenol compound. CONSTITUTION:A wax (e.g. shellac wax) is incorporated in a colorless or light- colored color-forming lactone compound (e.g. Crystal Violet lactone) and a phenol compound (e.g. 4,4'-isopropylidenediphenol), as required to obtain heat-sensitive coating liquid. In this liquid, a water-insoluble finely powdered urea/formalin resin, whose oil absorption is 350-400ml/100g when measured by a JIS K-5101 method, is contained in an amount of 85wt% of a heat-fusible material. Then an aqueous macromolecule adhesive (e.g. starch) is added. The liquid is applied on a support (e.g. paper) and dried. Thereafter surface treatment is performed. Thus an intended heat-sensitive paper with controlled scum adhesion is obtained.
申请公布号 JPS58212988(A) 申请公布日期 1983.12.10
申请号 JP19830008116 申请日期 1983.01.20
申请人 MITSUBISHI SEISHI KK 发明人 KOSAKA TAKAO;TAWARA YUKIO
分类号 B41M5/337;D21H19/38 主分类号 B41M5/337
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