| 摘要 |
PURPOSE:To seal a package through use of ordinary insulating resin which can be cured at a low temperature as a film for preventing soft error by sealing a ceramic base material and cap with the sealing agent fused by scanning the sealing band with an energy beam. CONSTITUTION:A semiconductor chip 1 is welded to the bottom of recess formed on the surface of a ceramic substrate 2 and this surface is covered with a soft error preventing film 5 consisting of epoxy or silicon organic resin which can be cured at about 200 deg.C. Then, a lead wire is connected to an electrode provided to the chip 1, it is guided to the external surface of lower part of substrate 2, and a ceramic cap 3 is sealed to the surface of substrate 2 covering the chip 1 with a low melting point glass 4. At this time, the laser beam is irradiated to the sealing band without giving thermal processing to the entire part and sealing is performed by momentarily melting the glass 4. Thereby, temperature of soft error preventing film 5 does not exceed 50 deg.C and use of resin as a film can be realized. |
