Production of a Ball Grid Array semiconductor component used in the manufacture of a Quad Flat Package comprises using a Tape Automated Bonding (TAB) strip

摘要

A Ball Grid Array semiconductor component is produced using a Tape Automated Bonding (TAB) strip. Production of a Ball Grid Array (BGA) semiconductor component comprises: (a) forming openings around each chip fixing region in a Tape Automated Bonding (TAB) strip (1); (b) fixing a semiconductor chip (3) to each fixing region of the TAB; (c) joining the chips at their electrode connecting surfaces (3a) to the TAB strip by bonding; (d) carrying out a plastic molding process with a resin on the bonded connection between the chip and the electrode connecting surface; (e) providing solder balls (8) on the reverse aide of the TAB strip in sections corresponding to the chip fixing sections; and (f) cutting the connecting sites to produce distinct semiconductor elements.