发明名称 FORMING METHOD FOR COMPOSITE SUBSTRATE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To obtain a gas phase grown layer of high quality by processing in advance the surface of a substrate to form a buried diffused layer so that the density value of line defects L.D. is approx. prescribed value, thereby improving the getter effect of the substrate. CONSTITUTION:In order to obtain a composite substrate for a semiconductor bipolar IC device by forming a gas phase grown layer on the surface of a silicon substrate, the surface of a substrate to form a buried diffused layer is processed in advance so that the density value of line defects L.D. is approx. 10<3>- 10<4>. This L.D. value has reverse correlation with the S.F. value of the gas phase grown layer and in normal correlation with the yield of the gas phase grown layer. In this manner, the getter effect of the substrate can be preferably obtained, thereby gaining the gas phase grown layer of high quality.
申请公布号 JPS58199530(A) 申请公布日期 1983.11.19
申请号 JP19820081514 申请日期 1982.05.17
申请人 TOKYO SHIBAURA DENKI KK 发明人 OGAWA KOUJI;HISATOMI KIYOSHI
分类号 H01L21/205;H01L21/322 主分类号 H01L21/205
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